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Design Engineering Intern/Co-Op (Summer/Fall 2024) - San Jose

Applications are closed

  • Internship
    Full-time
    Off-cycle Internship
  • Design
  • San Francisco

Requirements

  • Available to start May/Jun 2024 working 40 hours per week
  • Must be enrolled in BSEE or MSEE program
  • Minimum of 2 years of experience in ElectroMagnetics (EM)
  • Strong understanding of RF/Microwave fundamentals and Electromagnetic theory
  • Solid understanding of various RF sub-blocks including power amplifiers, low noise amplifiers, RF switches and couplers, filters, and multi-chip module
  • Ability to create 3D circuit model using EM tools and run simulations on passive RF structures and translate between the model, simulation, physical implementation, and measured performance
  • Good communication skills and logical reasoning skills, capable of breaking down complex programs, setting priorities, reporting progress, and executing to schedule
  • Ability to collect test data and debug circuit issues using standard lab instruments
  • Preferred Skills:
  • Good understanding of RF systems and familiarity with cellular standards and RFFE module requirements.
  • Familiarity with electromagnetic (EM) simulation CAD tools, as well as hands-on experience with both time and frequency domain circuit simulators, such as ADS (Momentum, FEM), Cadence (EMX, Spectre), or HFSS.
  • Experience and familiarity with RF test equipment, including network analyzers, spectrum analyzers, DC power supplies, and RF probes. Knowledge of network analyzer calibration and reference plane de-embedding

Responsibilities

  • In this impactful role you will be working as a core team member in the development of front-end modules for the fast-paced and highly competitive cellular handset market.
  • As a Multi-Chip Module Design Engineer, you will be responsible for developing next-generation, highly integrated RF Front-End Modules for mobile applications.
  • You will work with marketing and systems engineering team to translate customer specifications into design requirements at the multi-chip module (MCM) level.
  • You will be responsible for designing multi-chip modules by collaborating with other RFIC design engineers to achieve the best overall performance.
  • You will be responsible for supporting prototype development activities including evaluation, troubleshooting, and optimization to support timely customer samples.

Connecting Everyone and Everything, All the Time

Manufacturing & Electronics
Industry
5001-10,000
Employees

Mission & Purpose

Skyworks Solutions, Inc. is empowering the wireless networking revolution. Our highly innovative analog semiconductors are connecting people, places and things spanning a number of new and previously unimagined applications within the aerospace, automotive, broadband, cellular infrastructure, connected home, industrial, medical, military, smartphone, tablet and wearable markets. Skyworks is a global company with engineering, marketing, operations, sales and support facilities located throughout Asia, Europe and North America and is a member of the S&P 500® and Nasdaq-100® market indices (NASDAQ: SWKS