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Intern - DRAM Core Test Engineer

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Micron Technology

Mar 12, 2024

Applications are closed

  • Internship
    Full-time
    Off-cycle Internship
  • Software Engineering
    Engineering
  • Boise

Requirements

  • Qualifications:
  • Developing array core test solutions will require constant learning and continued technical growth. A successful candidate should understand hardware fundamentals and possess programming capability in a major language. Specific knowledge that'll help:
  • Basic R/L/C circuit knowledge
  • Digital systems and logic gate representation
  • Understanding of CMOS transistor operation
  • Intermediate to advanced programming capability [C++ or Python]
  • Basic Unix / Linux environment
  • Excellent communication and interpersonal skills
  • Basic statistics and data analytics
  • Education:
  • Looking for candidates that are pursuing bachelor’s or master's degree in electrical engineering, Computer Engineering, Computer Science or a related discipline.

Responsibilities

  • A successful test development engineer intern must develop a good understanding of test equipment hardware, device knowledge and software systems.
  • Develop, debug and support test programs from new product introduction phase up through high volume manufacturing
  • Write test programs and support scripts in C++, Python
  • Contribute input and feedback to help define next generation 'design for test' capabilities
  • Analyze device and test flow data to make informed test coverage decisions
  • Balance test time objectives while maintaining optimal yield and quality
  • Collaborate with partners in Product Engineering, Fab, Manufacturing, Yield Enhancement, Global Quality, Systems Integration Group, and Equipment Engineering teams to deliver the right test solution.

We're accelerating the transformation of information to intelligence.

Manufacturing & Electronics
Industry
1-10
Employees
1978
Founded Year

Mission & Purpose

Micron is a world leader in innovative memory solutions that transform how the world uses information. We have approximately 40,000 team members in 17 countries who work with the world’s most trusted brands, delivering memory and storage systems for a broad range of applications and sparking countless possibilities in technology.